Article: Publication No. WO/2009/108313 Published on Sept. 3, Assigned to Corning for Hermetically Sealing (American Inventors)

GENEVA, Sept. 10 -- Bruce G. Aitken, Shari E. Koval and Mark A. Quesada, all from the U.S., have developed a hermetically sealing a device without a heat treating step.

The patent has been assigned to Corning Inc., Corning, N.Y.

According to an abstract posted by the World Intellectual Property Organization, the invention relates to a "method for hermetically sealing a device without performing a heat treatment step and the resulting hermetically sealed device are described herein. The method includes the steps of positioning the un-encapsulated device in a desired location with respect to a deposition ...

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