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Article: Patent No. 7,589,407 Issued on Sept. 15, Assigned to Stats Chippac for Semiconductor Multipackage Module (California Inventor)
- Article from:
- US Fed News Service, Including US State News
- Article date:
- September 18, 2009
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ALEXANDRIA, Va., Sept. 18 -- Marcos Karnezos, Palo Alto, Calif., has developed a semiconductor multipackage module. The inventor was issued U.S. Patent No. 7,589,407 on Sept. 15.
The patent has been assigned to Stats Chippac Ltd., Singapore.
According to the description released by the U.S. Patent & Trademark Office: " This invention relates to semiconductor chip packaging and, particularly, to packaging suitable for stacked package modules (such as package-in-package modules). Semiconductor package substrates typically are laminates of two or more patterned metal layers separated by dielectric layers. Interconnection of the die (one or ...
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Article: STATS ChipPAC Appoints Chief Strategy Officer.
Business Wire;
August 23, 2004 ;
700+ words
...SINGAPORE & MILPITAS, Calif. -- STATS ChipPAC Ltd. ("STATS ChipPAC") (Nasdaq:STTS) (SGX: ST Assembly ... Chief Strategy Officer. Reporting directly to STATS ChipPAC's President and CEO, Jewler will have overall ...
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