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Article: Publication No. WO/2009/113831 Published on Sept. 17, Assigned to Cheil Industries for Multi-Functional Tape, Semiconductor Device Production Method (South Korean Inventors)
- Article from:
- US Fed News Service, Including US State News
- Article date:
- September 18, 2009
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GENEVA, Sept. 18 -- Yong Ha Hwang, Jae Hyun Cho, Gyu Seok Song and Chang Beom Chung, all from South Korea, have developed a multi-functional tape for semiconductor package and a method for manufacturing semiconductor device using the same.
The patent has been assigned to Cheil Industries Inc., Gyeongsangbuk-do, South Korea.
According to an abstract posted by the World Intellectual Property Organization, the invention relates to a "multi-functional tape for a semiconductor package that can be used for a back-grinding process, a dicing process, a pickup process, and a die-attaching process at the same time. In particular, the multi-functional tape for a semiconductor package includes an ...