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Article: Patent No. 07602204 Issued on Oct. 13, Assigned to Phicom Corporation for Probe card manufacturing method including sensing probe and the probe card, probe card inspection system
- Article from:
- US Fed News Service, Including US State News
- Article date:
- October 15, 2009
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ALEXANDRIA, Va., Sept. 15 -- Han-Moo Lee, is of Seoul, KR, has developed a Probe card manufacturing method including sensing probe and the probe card, probe card inspection system .The inventor was issued U.S. Patent No. 07602204 on Oct. 13.
The patent has been assigned Phicom Corporation, Seoul.
According to the abstract released by the U.S. Patent & Trademark Office: There is provided a method of manufacturing a probe card. A first passivation pattern for implementing a tip portion of an electrical inspection probe and a tip portion of a planarity sensing probe on a sacrificial substrate is formed, and an etching process using the first passivation pattern as an etch mask is ...
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Article: Investigation Conquers Probe-Card Problems.
Test & Measurement World;
November 1, 2000 ;
700+ words
... ... can determine the specific cause of probe-card failure. A failure investigation must ... with the wafer-test conditions and the probe-card manufacturing process. Figure 1 outlines ... observations are usually optical. For some probe card failures, although obvious visually ...
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