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Article: Patent No. 07601049 Issued on Oct. 13, Assigned to MEMC Electronic Materials, Inc. for Double side wafer grinder and methods for assessing workpiece nanotopology
- Article from:
- US Fed News Service, Including US State News
- Article date:
- October 15, 2009
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ALEXANDRIA, Va., Sept. 15 -- Sumeet S. BhagavatMilind S. BhagavatRoland R. Vandamme, Tomomi Komura, all of St. Louis, US, have developed a Double side wafer grinder and methods for assessing workpiece nanotopology .The inventors were issued U.S. Patent No. 07601049 on Oct. 13.
The patent has been assigned MEMC Electronic Materials, Inc., St. Peters.
According to the abstract released by the U.S. Patent & Trademark Office: A double side grinder comprises a pair of grinding wheels and a pair of hydrostatic pads operable to hold a flat workpiece (e.g., semiconductor wafer) so that part of the workpiece is positioned between the grinding wheels and part of the workpiece is positioned ...
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Article: MEMC ELECTRONIC MATERIALS REPORTS DISPOSITION BY VP ...
US Fed News Service, Including US State News;
February 2, 2009 ;
324 words
...WASHINGTON, Feb. 2 -- MEMC Electronic Materials Inc. (WFR), St. Peters, Mo ... directly. For more information about US Fed News contract awards please contact: Myron Struck, Managing Editor/US Bureau, US Fed News, Direct: 703/866-4708, Cell ...
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