Article: Patent No. 7,605,113 Issued on Oct. 20, Assigned to Advanced Technology Materials for Aqueous Cleaning Composition Containing Copper-specific Corrosion Inhibitor (U.S. Inventors)

ALEXANDRIA, Va., Oct. 28 -- William A. Wojtczak of (Austin, Texas, Ma. Fatima Seijo of Hayward, Calif., David Bernhard of Newtown, Conn., and Long Nguyen of San Jose, Calif., have developed an aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate. The inventors were issued U.S. Patent No. 7,605,113 on Oct. 20.

The patent has been assigned to Advanced Technology Materials Inc., Danbury, Conn.

According to the abstract released by the U.S. Patent & Trademark Office: "A semiconductor wafer cleaning formulation, including 1-35% wt. fluoride source, 20-60% wt. organic amine(s), 0.1-40% wt. nitrogenous component, ...

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