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Article: Patent No. 7,612,434 Issued on Nov. 3, Assigned to Denso for Electronic Device (Japanese Inventors)
- Article from:
- US Fed News Service, Including US State News
- Article date:
- November 4, 2009
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ALEXANDRIA, Va., Nov. 7 -- Takeshi Ishikawa of Nishikasugai-gun, Japan, Norihisa Imaizumi of Hoi-gun, Japan, and Yuuki Sanada of Nukata-gun, Japan, have developed an electronic device with wiring substrate and lead frame. The inventors were issued U.S. Patent No. 7,612,434 on Nov. 3.
The patent has been assigned to Denso Corp., Kariya, Japan.
According to the abstract released by the U.S. Patent & Trademark Office: "An electronic device includes: a first substrate and a second substrate; a lead frame disposed between the first and the second substrates for electrically connecting therebetween; and a first groove and a second groove disposed on the first and the second substrates, ...