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Article: Patent No. 7,612,450 Issued on Nov. 3, Assigned to Samsung Electronics for Semiconductor Package (South Korean Inventors)
- Article from:
- US Fed News Service, Including US State News
- Article date:
- November 4, 2009
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ALEXANDRIA, Va., Nov. 7 -- Jong-Gi Lee of Chungcheongnam-do, South Korea, and Tae-Joo Hwang of Gyeonggi-do, South Korea, have developed a semiconductor package with dummy board. The inventors were issued U.S. Patent No. 7,612,450 on Nov. 3.
The patent has been assigned to Samsung Electronics Co. Ltd., Gyeonggi-do.
According to the abstract released by the U.S. Patent & Trademark Office: "Provided are a semiconductor package and a method of fabricating the same. The semiconductor package includes a semiconductor chip, and a plurality of conductive balls, e.g., solder balls formed on a joint surface of the semiconductor chip. A dummy board includes openings aligned with the solder balls ...