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Article: Gold wire and solder joint microforce testing using microforce tester
- Article from:
- Experimental Techniques
- Article date:
- September 1, 2003
- Author:
CopyrightCopyright Society for Experimental Mechanics, Inc. Sep/Oct 2003. Provided by ProQuest LLC. (Hide copyright information)
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The continuous demand for minimization and high performance in electronic products is driving packaging technology into high density interconnects. The typical interconnection methods for microelectronic packages include wire bonding, solder connections and others. The reliability of advanced packages is closely governed by the thermo-mechanical properties of constituent materials, interconnects, their interfaces, and their microstructures.1 To support package design and reliability requirements, specialized experimental methods and tools need to be developed to carry out material testing for package microstructures. In this paper, newly developed experimental techniques for testing the ...