Metrology tool for metal film measurement.(Test & Measurement)
* Designed for on-line and near-line measurements on semiconductor wafers, optical devices, high-density chip-scale packaging and substrate applications
* Uses a combination of microbeam X-ray collimation technology and traditional energy dispersive XRF (EDXRF) spectroscopy
* Non-destructive metrology technique measures thickness and composition of up to five layers of deposited metals simultaneously
* Also determines bulk alloy composition for up to 20 elements
* Use of optically collimated X-rays delivers intensity gains of up to 1000 times over traditional XRF tools
* X-rays generated by 50W X-ray tube are redirected and focused on sample surface
* Available in benchtop, console, and automated wafer handling configurations
* MicroXR microbeam XRF platform
Thermo Electron Corporation
Tel 877-843-7668
www. …
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