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"Sockets support dense pitch BGA devices.(PACKAGING & INTERCONNECTS)." ECN-Electronic Component News. Advantage Business Media. 2006. HighBeam Research. 20 Apr. 2018 <https://www.highbeam.com>.
"Sockets support dense pitch BGA devices.(PACKAGING & INTERCONNECTS)." ECN-Electronic Component News. 2006. HighBeam Research. (April 20, 2018). https://www.highbeam.com/doc/1G1-146549848.html
"Sockets support dense pitch BGA devices.(PACKAGING & INTERCONNECTS)." ECN-Electronic Component News. Advantage Business Media. 2006. Retrieved April 20, 2018 from HighBeam Research: https://www.highbeam.com/doc/1G1-146549848.html
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The SS-BGA324J-02-01 from Ironwood Electronics allows 1.0 mm pitch, 23 mm body and 22 X 22 array ICs to be used in socket and operate without compromising performance in very high bandwidth applications. The 10 GHz bandwidth sockets support the very dense pitch BGA devices in a 500,000 actuations socket. The socket is designed to dissipate up to 7W without extra heat sinking and can handle up to 60W with custom heat sink. …
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