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Home » Publications » Industry magazines » Engineering magazines » ECN-Electronic Component News » May 2006 »
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    MLA

    "Sockets support dense pitch BGA devices.(PACKAGING & INTERCONNECTS)." ECN-Electronic Component News. Advantage Business Media. 2006. HighBeam Research. 20 Apr. 2018 <https://www.highbeam.com>.

    Chicago

    "Sockets support dense pitch BGA devices.(PACKAGING & INTERCONNECTS)." ECN-Electronic Component News. 2006. HighBeam Research. (April 20, 2018). https://www.highbeam.com/doc/1G1-146549848.html

    APA

    "Sockets support dense pitch BGA devices.(PACKAGING & INTERCONNECTS)." ECN-Electronic Component News. Advantage Business Media. 2006. Retrieved April 20, 2018 from HighBeam Research: https://www.highbeam.com/doc/1G1-146549848.html

    Please use HighBeam citations as a starting point only. Not all required citation information is available for every article, and citation requirements change over time.

Sockets support dense pitch BGA devices.(PACKAGING & INTERCONNECTS)

ECN-Electronic Component News
ECN-Electronic Component News

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May 1, 2006 | Copyright
COPYRIGHT 2009 Advantage Business Media. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights or concerns about this content should be directed to Customer Service.
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    <a href="https://www.highbeam.com/doc/1G1-146549848.html" title="Sockets support dense pitch BGA devices.(PACKAGING & INTERCONNECTS) | HighBeam Research">Sockets support dense pitch BGA devices.(PACKAGING & INTERCONNECTS)</a>

The SS-BGA324J-02-01 from Ironwood Electronics allows 1.0 mm pitch, 23 mm body and 22 X 22 array ICs to be used in socket and operate without compromising performance in very high bandwidth applications. The 10 GHz bandwidth sockets support the very dense pitch BGA devices in a 500,000 actuations socket. The socket is designed to dissipate up to 7W without extra heat sinking and can handle up to 60W with custom heat sink. …


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