HighBeam Research - Newspaper archives and journal articles
Options
Cancel changes
Follow us:
  • Subscription benefits
  • Log in
  • Sign up for a free, 7-day trial
  • Publications
  • Research topics
  • Topics home
  • People
    • Artists and Entertainers
    • Company executives
    • Historical figures
    • Politicians and Government officials
    • World Leaders
  • Issues and Events
    • Health and Medicine
    • Historical Events
    • Religion and Theology
    • Science and Technology
  • Places
  • Organizations
  • A-Z
    • A-G
    • H-O
    • P-T
    • U-Z
    • 0-9
  • Publications home
  • Journals
    • Academic journals
    • Business journals
    • Education journals
    • Math and Engineering journals
    • Medical journals
    • Science and Technology journals
    • Trade journals
  • Magazines
    • Business magazines
    • Computer magazines
    • Education magazines
    • Industry magazines
    • Lifestyle magazines
    • Medical magazines
  • Newspapers
    • International newspapers and newswires
    • Reports, newsletters, and transcripts
    • U.K. newspapers
    • U.S. newspapers and newswires
  • Reference works and books
    • Almanacs
    • Dictionaries and thesauruses
    • Encyclopedias
    • Non-fiction books
  • Subscription benefits
  • Log in
  • PUBLICATIONS HOME
  • Journals
    • Academic journals
    • Business journals
    • Education journals
    • Math and Engineering journals
    • Medical journals
    • Science and Technology journals
    • Trade journals
  • Magazines
    • Business magazines
    • Computer magazines
    • Education magazines
    • Industry magazines
    • Lifestyle magazines
    • Medical magazines
  • Newspapers
    • International newspapers and newswires
    • Reports, newsletters, and transcripts
    • U.K. newspapers
    • U.S. newspapers and newswires
  • Reference works and books
    • Almanacs
    • Dictionaries and thesauruses
    • Encyclopedias
    • Non-fiction books
Home » Publications » Industry magazines » Engineering magazines » ECN-Electronic Component News » December 2006 »
  • Save
    This article has been saved!
    You may organize and add notes about this article below.
    This article has been saved!
    View all saved articles
  • Export

    To export this article to Microsoft Word, please log in or subscribe.

    Have an account? Please log in

    Not a subscriber? Sign up today

  • Print
  • Cite

    MLA

    "Epoxy adhesive has high shock resistance.(PACKAGING & INTERCONNECTS)." ECN-Electronic Component News. Advantage Business Media. 2006. HighBeam Research. 20 Apr. 2018 <https://www.highbeam.com>.

    Chicago

    "Epoxy adhesive has high shock resistance.(PACKAGING & INTERCONNECTS)." ECN-Electronic Component News. 2006. HighBeam Research. (April 20, 2018). https://www.highbeam.com/doc/1G1-157180248.html

    APA

    "Epoxy adhesive has high shock resistance.(PACKAGING & INTERCONNECTS)." ECN-Electronic Component News. Advantage Business Media. 2006. Retrieved April 20, 2018 from HighBeam Research: https://www.highbeam.com/doc/1G1-157180248.html

    Please use HighBeam citations as a starting point only. Not all required citation information is available for every article, and citation requirements change over time.

Epoxy adhesive has high shock resistance.(PACKAGING & INTERCONNECTS)

ECN-Electronic Component News
ECN-Electronic Component News

See all results for this publication

Browse back issues of this publication by date

December 15, 2006 | Copyright
COPYRIGHT 2009 Advantage Business Media. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights or concerns about this content should be directed to Customer Service.
  • Permalink

    Create a link to this page

    Copy and paste this link tag into your Web page or blog:

    <a href="https://www.highbeam.com/doc/1G1-157180248.html" title="Epoxy adhesive has high shock resistance.(PACKAGING & INTERCONNECTS) | HighBeam Research">Epoxy adhesive has high shock resistance.(PACKAGING & INTERCONNECTS)</a>

Master Bond, Inc. has announced its EP21TDCHT, a two-component epoxy adhesive with high peel and shear strength. The formulation is designed to withstand exposure to vibration, impact, shock and thermal cycling. It has a one-to-one mix ratio by weight or volume, and it cures at room temperatures. It has a service operating temperature range of-100[degrees]F to +350[degrees]F. The product adheres to metals, glass, ceramics, rubbers and most plastics. …


To read the full text of this article and others like it, subscribe today!



Related articles on HighBeam Research

Design News
Conductive epoxy.(Master Bond's FL901S silver conductive epoxy adhesive film and preform system)

Design News; September 20, 1999

By Field, Karen Auguston; 240 words
Master Bond FL901S silver conductive epoxy adhesive film and preform system can be stored at ambient temperatures and fully cured at 250F (125C) in one hour or at 300F (150C) in only 30 minutes. Volume resistivity is less than 0.0002 ohm-cm and thermal conductivity is 10 BTU/hr/F/inch. Bond…
Mechanical Engineering-CIME
Structural adhesive.(MASTER BOND INC.'s EP3O, epoxy adhesive)(Brief Article)(Product Announcement)

Mechanical Engineering-CIME; July 1, 2001

256 words
MASTER BOND INC., HACKENSACK, N.J. A new, two-component epoxy adhesive, EP3O, is designed for high-performance bonding applications. It is said by the manufacturer to develop outstanding physical strength characteristics even when cured at ambient temperatures. Cure can be accelerated by the use of…
EE-Evaluation Engineering
Conductive epoxy adhesive.(Master Bond Inc.)(Brief article)

EE-Evaluation Engineering; September 1, 2011

269 words
EP76M-1 is a two-component nickel-filled conductive epoxy adhesive featuring a one-to-one mix ratio by weight or volume. Volume resistivity is 5 to 10 ohm-cm. The low-outgassing adhesive features a thermal conductivity of 8 to 9 BTU/ inft.sup.2]/hr/[degrees]F and a tensile shear strength of 2,000…
Circuits Assembly
Two-component epoxy adhesive.(Product Spotlight)(from Master Bond Inc. )(Brief Article)

Circuits Assembly; January 1, 2003

252 words
Master Bond EP72M3 is a two-component elastomer-modified epoxy adhesive for general purpose bonding. Formulated to cure at room temperature, or more rapidly at elevated temperatures with a one to one mix ratio, weight or volume, the bonds are resistant to thermal cycling and chemicals. The adhesive…
Adhesives & Sealants Industry
Epoxy adhesive: Master Bond Inc.(Formulated Adhesives)

Adhesives & Sealants Industry; June 1, 2004

237 words
EP35 is a two-component, high-temperature resistant epoxy adhesive that maintains high-strength bonds even after long exposures to temperatures in the 450-500[degrees]F range It has a 100 to 70 mix ratio by weight and can be applied without sagging or dripping, even on vertical surfaces. This…
See all related articles »

Publication Finder

Browse back issues from our extensive library of more than 6,500 trusted publications.

Popular publicationson HighBeam Research

The Mirror (London, England)
U.K. newspapers
The Boston Globe (Boston, MA)
Massachusetts newspapers
The Nation
Political magazines
Chicago Sun-Times
Illinois newspapers
The Economist (US)
Political magazines
Visit Cengage Brain
  • Company
  • About us
  • Subscription benefits
  • Group subscriptions
  • Careers
  • Privacy policy
  • Terms and conditions
  • Contact us
  • Help topics
  • FAQ
  • Search tips
  • Using the Research Center
  • Billing questions
  • Rights inquiries
  • Customer Service
  • Cengage Learning Network
  • Questia
  • CengageBrain.com
  • HighBeam Business
  • ed2go
  • MiLadyPro
  •  
HighBeam Research
Follow us:

HighBeam Research is operated by Cengage Learning. © Copyright 2018. All rights reserved.

The HighBeam advertising network includes: womensforum.com GlamFamily