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"High tensile strength thermal interface pads.(PACKAGING & INTERCONNECTS)." ECN-Electronic Component News. Advantage Business Media. 2007. HighBeam Research. 26 Apr. 2018 <https://www.highbeam.com>.
"High tensile strength thermal interface pads.(PACKAGING & INTERCONNECTS)." ECN-Electronic Component News. 2007. HighBeam Research. (April 26, 2018). https://www.highbeam.com/doc/1G1-169310842.html
"High tensile strength thermal interface pads.(PACKAGING & INTERCONNECTS)." ECN-Electronic Component News. Advantage Business Media. 2007. Retrieved April 26, 2018 from HighBeam Research: https://www.highbeam.com/doc/1G1-169310842.html
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MH & W International announces its Keratherm 86/82, a high tensile strength thermal interface material (TIM) that improves heat transfer from ICs and other components to their heat sinks, and provides durability for installation and long-term use. It is a thermally conductive, electrically isolating silicone film with a reinforcing fiberglass layer for tear and cut-through resistance. The silicone provides exceptional wetting properties for filling interface surfaces. …
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