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Home » Publications » Industry magazines » Engineering magazines » ECN-Electronic Component News » September 2007 »
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    "High tensile strength thermal interface pads.(PACKAGING & INTERCONNECTS)." ECN-Electronic Component News. Advantage Business Media. 2007. HighBeam Research. 26 Apr. 2018 <https://www.highbeam.com>.

    Chicago

    "High tensile strength thermal interface pads.(PACKAGING & INTERCONNECTS)." ECN-Electronic Component News. 2007. HighBeam Research. (April 26, 2018). https://www.highbeam.com/doc/1G1-169310842.html

    APA

    "High tensile strength thermal interface pads.(PACKAGING & INTERCONNECTS)." ECN-Electronic Component News. Advantage Business Media. 2007. Retrieved April 26, 2018 from HighBeam Research: https://www.highbeam.com/doc/1G1-169310842.html

    Please use HighBeam citations as a starting point only. Not all required citation information is available for every article, and citation requirements change over time.

High tensile strength thermal interface pads.(PACKAGING & INTERCONNECTS)

ECN-Electronic Component News
ECN-Electronic Component News

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September 1, 2007 | Copyright
COPYRIGHT 2009 Advantage Business Media. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights or concerns about this content should be directed to Customer Service.
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    <a href="https://www.highbeam.com/doc/1G1-169310842.html" title="High tensile strength thermal interface pads.(PACKAGING & INTERCONNECTS) | HighBeam Research">High tensile strength thermal interface pads.(PACKAGING & INTERCONNECTS)</a>

MH & W International announces its Keratherm 86/82, a high tensile strength thermal interface material (TIM) that improves heat transfer from ICs and other components to their heat sinks, and provides durability for installation and long-term use. It is a thermally conductive, electrically isolating silicone film with a reinforcing fiberglass layer for tear and cut-through resistance. The silicone provides exceptional wetting properties for filling interface surfaces. …


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