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Home » Publications » Industry magazines » Engineering magazines » ECN-Electronic Component News » March 2003 »
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    MLA

    "DSP-based Servo Drives. (Special Report: Motors & Motion Control Subsystems)." ECN-Electronic Component News. Advantage Business Media. 2003. HighBeam Research. 24 Apr. 2018 <https://www.highbeam.com>.

    Chicago

    "DSP-based Servo Drives. (Special Report: Motors & Motion Control Subsystems)." ECN-Electronic Component News. 2003. HighBeam Research. (April 24, 2018). https://www.highbeam.com/doc/1G1-98880614.html

    APA

    "DSP-based Servo Drives. (Special Report: Motors & Motion Control Subsystems)." ECN-Electronic Component News. Advantage Business Media. 2003. Retrieved April 24, 2018 from HighBeam Research: https://www.highbeam.com/doc/1G1-98880614.html

    Please use HighBeam citations as a starting point only. Not all required citation information is available for every article, and citation requirements change over time.

DSP-based Servo Drives. (Special Report: Motors & Motion Control Subsystems).

ECN-Electronic Component News
ECN-Electronic Component News

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March 1, 2003 | Copyright
COPYRIGHT 2009 Advantage Business Media. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights or concerns about this content should be directed to Customer Service.
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    <a href="https://www.highbeam.com/doc/1G1-98880614.html" title="DSP-based Servo Drives. (Special Report: Motors & Motion Control Subsystems). | HighBeam Research">DSP-based Servo Drives. (Special Report: Motors & Motion Control Subsystems).</a>

Pacific Scientific, a Danaher Motion Company, has introduced the PCE800 Series Servo Drives. They feature 480V AG operation, making them powerful enough for big jobs and compatible with European voltage requirements. They are small enough to fit into a 10" cabinet, making them suitable for applications where space is at a premium. They are appropriate for new installations or as a retrofit drive option in applications such as electronic assembly, semiconductor manufacturing, robotics, packaging, printing and material handling. …


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